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 PMEG3010EH_EJ_ET_4 ? NXP B.V. 2007. All rights reserved. Product data sheet Rev. 04 — 20 March 2007 7 of 11 NXP Semiconductors PMEG3010EH/EJ/ET 1 A very low VF MEGA Schottky barrier recti?ers 10. Packing information [1] For further information and the availability of packing methods, see Section 14. 11. Soldering Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PMEG3010EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3010EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3010ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235 Re?ow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Re?ow soldering footprint SOD123F Re?ow soldering is the only recommended soldering method. Dimensions in mm Fig 9. Re?ow soldering footprint SOD323F (SC-90) 2.1 1.6 1.6 2.9 4 4.4 1.1 1.2 1.1 (2×) solder lands solder resist occupied area solder paste msa433 1.65 0.50 (2×) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste |